引用本文:王正平,孙松林.Ni—P—Si3N4纳米粒子化学复合镀工艺优化及镀层性能表征[J].中国表面工程,2001,(3):24~29
.The Optimization of Ni-P Electroless Composite Plating with Si3N4 Nano-particlesand the Characterization of the Coating Properties[J].China Surface Engineering,2001,(3):24~29
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Ni—P—Si3N4纳米粒子化学复合镀工艺优化及镀层性能表征
王正平,孙松林
作者单位
摘要:
论述了化学复合镀的机理及用正交试验方法确定Ni-P-Si3N4纳米粒子化学复合镀工艺过程，并着重对镀层热处理后镀层的硬度进行了研究。测试表明：镀层硬度高，强度大，耐磨性好。
关键词:  纳米粒子 化学复合镀 正交试验 镀层硬度
DOI：
分类号:TB383 TQ153
基金项目:国家杰出青年科学基金(19725209)黑龙江省自然科学基金(99-8812)
The Optimization of Ni-P Electroless Composite Plating with Si3N4 Nano-particlesand the Characterization of the Coating Properties
王正平  孙松林' target='_blank'>Wang Zhengping Sun Songlin Cao Maosheng Zhu Jing Yang Huijing Chen Yujin Wang Biao
Abstract:
This paper described the basic principle of electroless composite plating, the optimization of the Ni-P composite plating with Si3N4 nano-particles by the orthogonal dosign, and the studies of coating hardness after heat treatment. It was indicated that the higher the mirco- hardness and strength, the better the wear-resistance of coating became.
Key words:  Nano-particle,Electroless Composite Plating,Orthogonal Method,Hardness of the coating
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