基底温度对掺氟类金刚石碳膜摩擦学性能的影响

崔锦峰<sup>1</sup>; 杨涛<sup>1; 2</sup>; 张斌<sup>2</sup>; 强力<sup>1; 2</sup>; 郑愉<sup>1; 2</sup>; 张俊彦<sup>2</sup>

引用本文:	崔锦峰，杨涛，张斌，强力，郑愉，张俊彦.基底温度对掺氟类金刚石碳膜摩擦学性能的影响[J].中国表面工程,2012,25(3):33~36
	CUI Jin-feng, YANG Tao, ZHANG Bin, QIANG Li, ZHENG Yu, ZHANG Jun-yan.Influence of Substrate Temperature on the Tribological Properties of Fluorinated Diamond-like Carbon Films[J].China Surface Engineering,2012,25(3):33~36

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基底温度对掺氟类金刚石碳膜摩擦学性能的影响
崔锦峰，杨涛，张斌，强力，郑愉，张俊彦^1,2
1. 兰州理工大学石油化工学院, 兰州 730050;2. 中国科学院兰州化学物理研究所固体润滑国家重点实验室，兰州 730000

摘要:

以CF₄, CH₄和H₂作为前驱气体，改变基底温度，通过直流脉冲等离子气相沉积法(PECVD)制备掺氟类金刚石碳膜，用傅里叶红外光谱仪分析薄膜的键合结构，用拉曼光谱仪分析薄膜中杂化碳的sp²和sp³的存在状态，用纳米压痕仪和UMT2MT摩擦磨损实验机分别测量了薄膜的硬度、摩擦因数等机械性能。结果表明，F主要以C-F₃，C-F_x(x=1,2,3)基团的形式存在于薄膜中；基底温度从不加热到500 ℃的范围，薄膜能够保持较低于0.020的摩擦因数；且基底温度为400 ℃时薄膜具有0.016的最低摩擦因数，但当基底温度超过600 ℃时，会破坏薄膜的内部结构而使机械性能下降。

关键词: 摩擦因数氟掺杂等离子增强气相沉积 (PECVD)

DOI：

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基金项目:国家自然科学基金(50823008, 50975273)；国家科技部项目(2010DFB34050)

Influence of Substrate Temperature on the Tribological Properties of Fluorinated Diamond-like Carbon Films

CUI Jin-feng, YANG Tao, ZHANG Bin, QIANG Li, ZHENG Yu, ZHANG Jun-yan^1,2

1. School of Petrochemical Engineering, Lanzhou University of Technology, Lanzhou 730050;2. State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000

Abstract:

Direct current plasma enhanced chemical vapor deposition (PECVD) was employed to fabricate fluorine doped carbon films with CF₄, CH₄ and H₂ as precursor gases under different substrate temperatures. The bonding structures of the films were revealed by Fourier infrared spectrometer, the sp² and sp³ hybrid carbon status was probed by Raman spectrometer, and the film hardness and friction were investigated by the nanoindentation instrument and UMT2MT reciprocating tribometer, respectively. The results show that F is mainly presented in the forms of C-F₃ and C-F_x(x=1,2,3) groups in the films. The film fabricated in the substrate temperature ranging from no heat to 500 ℃ showed relatively low friction coefficient about less than 0.020. The lowest friction coefficient of the film was observed about 0.016 at 400 ℃, and the film structure would be destroyed and the mechanical properties worsened significantly while the substrate temperature exceeded 600 ℃.

Key words: friction coefficient fluorine doped plasma enhanced chemical vapor deposition (PECVD)